| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition system and a film deposition method where the generation of secondary particles caused by film peeling easy to be generated by long term working is suppressed, and the deposition of a thin film of high quality is made possible. SOLUTION: The film deposition system where a target material is evaporated from a target 1 by arc discharge, so as to be deposited on a substrate 2 is provided with a sticking face-changing mechanism changing the particle sticking face 5 of a sticking preventive plate 3 capturing particles 7 from the target 1 without carrying out atmospheric air release. COPYRIGHT: (C)2008,JPO&INPIT
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