| 发明名称 |
Method of manufacturing multi-layered printed circuit board |
| 摘要 |
The present invention relates to a method of manufacturing a multi-layered printed circuit board which can decrease the cost and time required to produce the printed circuit board and can improve heat radiation characteristics and bending strength.
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| 申请公布号 |
US2008209718(A1) |
申请公布日期 |
2008.09.04 |
| 申请号 |
US20080007265 |
申请日期 |
2008.01.08 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHUNG CHAN YEUP;KIM GEUN HO;CHOI SEONG WOO;YANG DEK GIN |
| 分类号 |
H05K3/00;H05K3/20 |
主分类号 |
H05K3/00 |
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