METHOD FOR DYING POLYIMIDE FILM TO INCREASING THE ADHESION BETWEEN METAL AND THE POLYIMIDE FILM

摘要

A method for drying a polyimide film is provided to improve adhesion at room temperature and high temperature, particularly, adhesion to a metal layer, and to obtain a flexible copper clad laminate with improved reliability. A method for drying a polyimide film for improving the adhesion to a metal layer comprises a step of heating the polyimide film under a reduced pressure of 10^-4 to 10^-1 Torr at a temperature of 60-120 deg.C. The polyimide film is wound into a roll while it is dried. The depressurization and heat steps are carried out for at least 120 minutes.