SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

摘要

A semiconductor device and a wire bonding method are provided to enhance bonding capability between wires and bumps by bonding the wires at a surface of a wedge having a large attaching area. A semiconductor device includes a bump(21) and a wire(12). The bump formed by bending and stacking the wire on a second bonding point includes a wire bending convex portion opposite to a first bonding point which is connected to the second bonding point using the wire. The wire, which is elongated from the first bonding point to the bump and contacted with an upper surface of the bump, includes a cutting plane smaller than a wire cutting plane at the wire bending convex portion.