| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a tape used for a semiconductor package and its cutting method. <P>SOLUTION: In the tape used for the semiconductor package including a base material 10 with a plurality of divided regions, lead wires 1 formed at each divided region on the base material 10, and thin wires 2 connected with the appropriate lead wires 1, the tape has an offset thin wire arrangement structure in which the thin wires 2 are separated from central lines 11 of the lead wires 1 in at least one divided region. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
