| 摘要 |
A method of assembling a multilayer bus bar assembly includes coating a dielectric layer with a molten reactive hot-melt adhesive, placing the dielectric layer between first and second subassemblies, wherein the first and second subassemblies comprise a conductive element, adhering the molten reactive hot-melt adhesive to the subassemblies by applying a pressure of at least about one bar to the multilayer bus bar assembly for at least about one minute prior to the adhesive cooling to room temperature to provide a bonding strength between the dielectric material and a selected one of the first and second subassemblies of at least 1500 Newtons on a 25 millimeter by 25 millimeter sample when tested in accordance with ASTM D-1062.
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