TEST OF ELECTRONIC DEVICES AT PACKAGE LEVEL USING TEST BOARDS WITHOUT SOCKETS

摘要

A test system (100) is proposed; the test system is used to test electronic devices (105;105 ) each one having a case (205;205 ) with a plurality of terminals (210;210 ) for example, of the BGA type. The test system includes a set of (one or more) test boards (125;125 ). Each test board includes a plurality of banks of electrically conductive receptacles (225;225 ), each one for resting a corresponding electronic device; each receptacle is adapted to receive a terminal (210;210 ) of the corresponding electronic device. A set of (one or more) boxes (230) is arranged in operation above the test boards. Each box defines an expandable chamber (235) for a conditioning fluid; particularly, the box includes a rigid body (240), a flexible membrane (245) of a thermally conductive material facing the test boards, an inlet (330), and an outlet (335). Means (350) is provided for controlling a temperature of the conditioning fluid (for example, a heat exchanger). The test system further includes means (345) for forcing the conditioning fluid to circulate under pressure through the chambers, so as to expand the flexible membranes downwardly; the expanded flexible membranes press the electronic devices against the test boards to lock the electronic devices mechanically on the test boards and to condition the electronic devices thermally.