POLISHING PAD HAVING PATTERN WITH GROOVE FOR USE IN CHEMICAL MECHANICAL POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing (CMP) device solving the problem of unequal rate of polishing over the whole substrate.

SOLUTION: This polishing pad for polishing the substrate used in the chemical mechanical polishing device is provided with a polishing surface having: a first polishing region; a second polishing region surrounding the first polishing region; and a spiral groove formed on the polishing surface. The spiral groove has a first pitch in the first polishing region and a second pitch different from the first pitch in the second polishing region.

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