| 摘要 |
PROBLEM TO BE SOLVED: To prevent damage to release film and improve the molding precision of moldings. SOLUTION: A resin sealing method uses a compression mold 24 which has an upper mold 10 and a lower mold 20 arranged so as to oppose the upper mold 10 and be capable of accessing or separating from the upper mold 10. The lower mold 20 comprises a frame-formed mold 22 having a through hole 22A and a compression mold 24 arranged so as to be engaged in the through hole 22A, and a to-be-molded molding 60 is compression-sealed with a resin 40 in a cavity 70 formed on the opposite surface 28 of the lower mold 20. The resin sealing method has the process of supplying a release film 50 onto the opposite surface 28 of the lower mold 20 and the process of sucking the release film 50 to the opposite surface 28 of the lower mold 20, with a level difference D1 formed between the position of the opposite surface 28A in the frame-formed mold 22 and the position of the opposite surface 28B in the compression mold 24. COPYRIGHT: (C)2008,JPO&INPIT |
