发明名称 MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a multilayer flexible printed wiring board capable of controlling and remarkably reducing compression of an end surface of a mounting substrate, and ensuring the planarity of the substrate, and to provide a method of inexpensively and stably manufacturing the wiring board. SOLUTION: The multilayer flexible printed wiring board comprises a cable portion which is formed of one part of a flexible printed wiring board having a wiring pattern on one surface of a flexible insulating base material 1; and a mounting substrate formed by pasting a resin base material on the flexible printed wiring board via an interlayer adhesive and having an electronic component to be mounted thereon. In the resin base material constituting the mounting substrate, a low elastic portion formed by removing one part or the entire of the resin base material is formed on a portion positioned on the end of the mounting substrate in the thickness direction of the resin base material. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008186851(A) 申请公布日期 2008.08.14
申请号 JP20070016843 申请日期 2007.01.26
申请人 NIPPON MEKTRON LTD 发明人 ISHIHARA KEIEN;MATSUDA FUMIHIKO
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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