发明名称 SUBSTRATE FOR A FLEXIBLE MICROELECTRONIC ASSEMBLY
摘要 Substrates (240) having integrated rigid (236) and flexible regions (234) and methods of fabricating such substrates (240) are disclosed. The substrates may- advantageous Iy be used for mounting semiconductor chips used in flexible microelectronic assemblies.
申请公布号 WO2008066894(A3) 申请公布日期 2008.08.14
申请号 WO2007US24589 申请日期 2007.11.28
申请人 TESSERA, INC.;KANG, TECK-GYU;PARK, JAE, M.;KUBOTA, YOICHI 发明人 KANG, TECK-GYU;PARK, JAE, M.;KUBOTA, YOICHI
分类号 H01L23/498;H01L23/057 主分类号 H01L23/498
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