| 摘要 |
<p>A thermosetting composite resin composition, a prepreg prepared by using the composition, and a composite film prepared by using the composition are provided to reduce dielectric loss and to allow desired dielectric constant to be obtained. A thermosetting composite resin composition comprises a base resin comprising a cycloolefin polymer of solid state; an organic solvent which dissolves the base resin; a crosslinking agent; an initiator; and at least one inorganic filler selected from BaTiO3, SrTiO3, TiO2, PZT, Al, Cu, Ni, Fe, Ag, Ti, Cr, Si, Mg, Zn, Sn, Pb, Ti, Zr, Ta, Pt, carbon black and graphite, wherein the ratio of the base resin and the crosslinking agent is 95:5 to 80:20 by weight. The composition has a dielectric constant of 4-1,750 according to the content of the inorganic filler.</p> |
