| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method used for RTP (Rapid Thermal Process) to improve temperature uniformity. SOLUTION: The present invention provides an apparatus and a method for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides an apparatus and a method for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate. COPYRIGHT: (C)2008,JPO&INPIT |
