<p>Disclosed is an aluminum chelate type latent curing agent which can cure a thermocurable epoxy resin at a relatively low temperature within a short period. Also disclosed is a process for producing the aluminum chelate type latent curing agent, which can control the curing conditions for the latent curing agent relatively readily. The aluminum chelate type latent curing agent is produced by reacting an aluminum chelating agent with a silsesquioxane-type oxetane derivative in the presence of an alicyclic epoxy compound, thereby incorporating the aluminum chelating agent in a latent state.</p>
申请公布号
WO2008090719(A1)
申请公布日期
2008.07.31
申请号
WO2007JP75136
申请日期
2007.12.27
申请人
SONY CHEMICAL & INFORMATION DEVICE CORPORATION;KOMURO, KATSUHIKO;ITO, MASAHIKO;MASUKO, DAISUKE