| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting composition for a photo-semiconductor, having a high penetrating property, excellent in close adhesion to a housing material, etc., for sealing a light-emitting element and light fastness against a short wave length light on using it as a sealant for sealing the light-emitting element of a photo-semiconductor element such as a light-emitting diode, etc., and further, since having an extremely high heat resistance, without developing discoloration caused by the heat generation of the light-emitting element sealed by the cured material. <P>SOLUTION: The thermosetting composition for the photo-semiconductor, containing a silicone resin having ≥1 cyclic ether-containing group in its molecule, a liquid state acid anhydride and a curing accelerator is provided. Either of the pseudo light extinction coefficients of the liquid state acid anhydride and curing accelerator at 25°C in tetrahydrofuran (THF) in 400 nm wave length is ≤0.1, and also the pseudo light extinction coefficient of the mixture of the liquid state acid anhydride and curing accelerator at 25°C in 400 nm wave length is 0.2 to 10. <P>COPYRIGHT: (C)2008,JPO&INPIT |
