| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To hold a substrate while preventing deformation in a substrate holder and a surface shape measuring device and a stress measuring device having the substrate holder. <P>SOLUTION: The substrate holding mechanism 20 of a stress measuring device has a portion 201 for supporting a substrate 9 from below without touching by jetting gas on the lower surface 91 side of the substrate 9, and a cylindrical movement regulating portion 202 for regulating movement of the substrate 9 supported by the supporting portion 201 by abutting against the side face of the substrate 9. The supporting portion 201 has a disklike porous member 203 opposing the lower surface 91 of the substrate 9, and the substrate holding mechanism 20 supports the surface of the substrate 9 without touching the supporting portion 201 by jetting gas substantially uniformly and entirely from the upper surface 2031 of the porous member 203. Consequently, the substrate 9 can be held while preventing deformation thereoff. As a result, the surface shape of the substrate 9 can be determined with high precision and the stress in a film on the substrate 9 can be measured with high precision. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
