发明名称 FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD THEREOF, BACKLIGHT UNIT HAVING FLEXIBLE PRINTED CIRCUIT BOARD
摘要 A flexible PCB(Printed Circuit Board), a method for manufacturing the same, and a backlight unit having the same are provided to simplify a process by replacing a temporal bonding process and a thermocompression bonding process of a coverlay layer with an ink coating process. A flexible PCB(200a) includes a both-sided copper clad laminate(20) and ink layers(100). The both-sided copper clad laminate is composed of an insulation layer(20a), an adhesive(20b), and a copper foil layer(20c) or the insulation layer and the copper foil layer. The ink layers are respectively formed on upper and lower surfaces of the copper foil layer of the both-sided copper clad laminate to function as a coverlay layer of a conventional flexible PCB.
申请公布号 KR20080068955(A) 申请公布日期 2008.07.25
申请号 KR20070006424 申请日期 2007.01.22
申请人 UTRONIX INC. 发明人 KIM, EUN IL;LEE, YOUNG WOO;LEE, JUNG YUL
分类号 H05K1/02 主分类号 H05K1/02
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