METHOD OF MANUFACTURING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate capable of forming a conductive pattern having no defect such as damage on both the faces of the substrate without generating the defect such as the damage on both the faces of the substrate. SOLUTION: The method of manufacturing the substrate has: a process P1 for forming a first protection film covering a second principal plane of the substrate; a process P5 for forming an a-ITO film on a first principal plane after the process P1; a process P6 for patterning the a-ITO film by forming a first resist film on the a-ITO film and using the first resist film; a process P7 for removing the first resist film; a process P10 for forming a second protection film on a shape covering a pattern of the a-ITO film on the first principal plane; a process P11 for removing the first protection film on the second principal plane after the process P10; a process P13 for forming the a-ITO film on the second principal plane after the process P11; a process P14 for patterning the a-ITO film by forming a second resist film on the a-ITO film and using the second resist film; and a process P15 for removing the second resist film. COPYRIGHT: (C)2008,JPO&INPIT