发明名称 |
METHODS OF PACKAGING A SEMICONDUCTOR DIE AND PACKAGE FORMED BY THE METHODS |
摘要 |
A method of packaging a semiconductor die. The method comprises mounting a semiconductor die to a die attach pad on a carrier and electrically coupling an electrode of the semiconductor die and a contact pad on the carrier with a clip carried by a sacrificial substrate. The method further comprises removing the sacrificial substrate to release the clip. The method may be extended to accommodate a carrier having multiple device regions each with a die attach pad and a contact pad for mounting multiple semiconductor die. |
申请公布号 |
EP1946364(A1) |
申请公布日期 |
2008.07.23 |
申请号 |
EP20060821208 |
申请日期 |
2006.10.27 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
DIJKSTRA, PAUL;GROENHUIS, ROELF |
分类号 |
H01L21/48;H01L21/60;H01L21/68;H01L23/31;H01L23/495 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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