发明名称 MULTILAYER CHIP CAPACITOR
摘要 A multilayer chip capacitor is provided to reduce ESL(Equivalent Series Inductance) thereof and prevent ESR(Equivalent Series Resistance) from being excessively lowered, thereby stabilizing power supply to a high frequency circuit when the multilayer chip capacitor is applied as a decoupling capacitor. A mutlilayer chip capacitor(100) includes a capacitor body(101), a plurality of internal electrodes, and external electrodes(131-134). The capacitor body is formed by stacking a plurality of dielectric layers and has a bottom surface(A) serving as a mounting surface. The internal electrodes are opposed to each other with the dielectric layers interposed therebetween in the capacitor. The external electrodes are formed on the bottom surface and are connected to the corresponding internal electrodes. The internal electrodes are disposed perpendicular to the bottom surface. Leads of the internal electrodes having different polarities adjacent to each other in a stacking direction are disposed to be adjacent to each other.
申请公布号 KR20080065473(A) 申请公布日期 2008.07.14
申请号 KR20070002635 申请日期 2007.01.09
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, BYOUNG HWA;WI, SUNG KWON;CHUNG, HAE SUK;PARK, DONG SEOK;PARK, SANG SOO;PARK, MIN CHEOL
分类号 H01G4/005;H01G4/30 主分类号 H01G4/005
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