SEMICONDUCTOR PACKAGE

摘要

A semiconductor package is provided to solve lacking problem of a rewiring space in a wafer level package and to realize a stack structure of a package with a simple structure. A semiconductor package includes a semiconductor chip(20), a substrate(10), a rewiring(30), an insulation layer(35), and at least one solder ball(50). The substrate surrounds a side surface of the semiconductor chip. The rewiring is formed under the semiconductor chip and the substrate, and is electrically connected to the semiconductor chip. The insulation layer surrounds the rewiring. At least one solder ball is formed under the insulation layer. A side of the substrate forms the same plane as that of a side of the insulation layer and has a scribe line. The substrate is a part of a semiconductor material wafer on which the semiconductor chip is formed.