发明名称 LAPPING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a lapping device capable of preventing a practical CMP device from being occupied for many hours to dispense with readjustment and lapping again when attaching a retainer ring for replacement to a polishing head of the practical CMP device after polishing it in advance. <P>SOLUTION: This lapping device is provided with a platen 3 on which the polishing head 1 with the retainer ring is put by letting polishing faces oppose face-to-face and a rotary roller 2 being a mechanism giving driving force for rotating the polishing head 1 with the retainer ring on the platen 3. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008149408(A) 申请公布日期 2008.07.03
申请号 JP20060339714 申请日期 2006.12.18
申请人 FUJITSU LTD 发明人 AOYAMA KATSUHIKO;AKABOSHI FUMIHIKO;SHOJI TAKANORI
分类号 B24B37/04;B24B37/30;H01L21/304 主分类号 B24B37/04
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