| 摘要 |
Certain embodiments relate to electronic devices and methods for forming electronic devices having a component shielded by a reworkable RF shield. The RF shield may be positioned to surround one or more components on a substrate. The RF shield may include a plurality of sidewalls and a top wall, the plurality of sidewalls including bumps extending outward therefrom. A portion of the top wall may be removed from the RF shield. The one or more components positioned under the top wall of the RF shield may be repaired or replaced if necessary. A lid may then be positioned over the removed portion of the top wall and placed so that the bumps engage apertures in the lid and result in the lid being rigidly coupled to the sidewalls. In one aspect of certain embodiments, a groove may be formed on one or more surfaces of the top wall. Other embodiments are described and claimed.
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