| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for holding an electronic component for positioning and holding the electronic component, an apparatus for manufacturing electronic components, and a method of holding an electronic component. SOLUTION: The device 10 for holding an electronic component has a pedestal 12 for loading the electronic component. A sucking hole 16 is arranged on the upper surface 14 of the pedestal 12, while open holes 20 are arranged on side surfaces thereof. The open holes 20 and the sucking hole 16 are connected in an inner portion of the pedestal 12. The upper surface 14 of the pedestal 12 is a little bit larger than the planar size of the electronic component to be loaded thereon. Horizontally movable centering pawls 24 are arranged in side directions of the pedestal 12. When the centering pawls 24 contact the side surfaces of the pedestal 12 by moving in horizontal directions, the open holes 20 are closed with top ends of the centering pawls 24. The centering pawls 24 protrude upward as compared to the upper surface 14 of the pedestal 12, and can bring the electronic component toward the center of the pedestal 12 with the protruding portions. COPYRIGHT: (C)2008,JPO&INPIT
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