| 摘要 |
A TAB inspecting method is provided to correct a process condition corresponding to heat expansion of a tape carrier by inducing a heat expansion correction system of tape carrier during TAB inspection, thereby optimizing a TAB align state. A TAB inspecting method comprises the following steps. A module is provided. In the module, a TAB(Tape Automated Bonding) bonding process between a tape carrier and an LC(Liquid Crystal) panel and between the tape carrier and a PCB(Printed Circuit Board) is completed. A TAP align state is confirmed in the module. By measuring a heat expansion amount of the tape carrier in the module where the align confirmation is completed, a TAP process condition is corrected. By performing TAB inspection, it is inspected where a defect is present in the module. |
