| 发明名称 |
CATIONICALLY POLYMERIZABLE RESIN COMPOSITION FOR MOLDING, AND MOLDED ARTICLE USING THE SAME |
| 摘要 |
<p>Disclosed is a cationically polymerizable resin composition for molding, which contains 70-99 parts by mass of an epoxy compound (A) having 2-4 epoxy groups and an aromatic skeleton, 1-30 parts by mass of an aromatic monomer (B) having 1-2 vinyl groups, and a cationic curing agent (C). This cationically polymerizable resin composition for molding is characterized in that a mixture of the epoxy compound (A) and the aromatic monomer (B) at the above-mentioned mass ratio is in a liquid state at room temperature (25°C). Also disclosed is a molded article which is characterized by being obtained by curing the cationically polymerizable resin composition for molding.</p> |
| 申请公布号 |
WO2008078692(A1) |
申请公布日期 |
2008.07.03 |
| 申请号 |
WO2007JP74690 |
申请日期 |
2007.12.21 |
| 申请人 |
DH MATERIAL INC.;SHIBATA, OU;FUJITA, YUKIKO |
发明人 |
SHIBATA, OU;FUJITA, YUKIKO |
| 分类号 |
C08G59/24 |
主分类号 |
C08G59/24 |
| 代理机构 |
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代理人 |
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| 主权项 |
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