| 摘要 |
A connective structure of a PCB and a curl in a semiconductor package molding apparatus is provided to reduce a manufacturing cost by minimizing the contact area between the PCB and the curl. A semiconductor package molding apparatus manufactures a semiconductor package(120) by molding a semiconductor chip with a molding compound. A connective structure for connecting a PCB(110) with a curl includes a PCB having a slot, a supporting part(150), and a gate(112). The semiconductor package is mounted on the PCB. The slot is filled with the supporting part. The gate is used for applying the molding compound to the semiconductor package. A PCB region is formed in a predetermined interval from the semiconductor package. A curl is loaded on the supporting part. |
