| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition material for encapsulation which has non-halogen and non-antimonical components and attains superior flame resistance, without causing reliability such as moldability, reflow resistance, moisture resistance, and high-temperature shelf life, to reduce, and to provide a manufacturing method for the same and an electronic component device that incorporates elements encapsulated by the same. SOLUTION: In an epoxy resin composition material for encapsulation, containing (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler agent, the UL-94 test is performed by using a test piece for the UL-94 test produced by the use of the epoxy resin composition material for encapsulation; and subsequently an expanding layer with maximum thickness of 0.8 to 2.0 mm is formed on the top surface of the test piece. COPYRIGHT: (C)2008,JPO&INPIT
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