| 发明名称 |
ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE PRODUCTION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE BY USING THE SAME |
| 摘要 |
Disclosed is an adhesive sheet for semiconductor production, which is used for bonding a semiconductor device to an object and subjecting the semiconductor device to wire bonding. This adhesive sheet for semiconductor production is characterized by containing a lipophilic layered clay mineral. |
| 申请公布号 |
WO2008075609(A1) |
申请公布日期 |
2008.06.26 |
| 申请号 |
WO2007JP74009 |
申请日期 |
2007.12.13 |
| 申请人 |
NITTO DENKO CORPORATION;AMANO, YASUHIRO;TERADA, YOSHIO;TAKAMOTO, NAOHIDE |
发明人 |
AMANO, YASUHIRO;TERADA, YOSHIO;TAKAMOTO, NAOHIDE |
| 分类号 |
H01L21/52;C09J5/06;C09J7/00;C09J11/04;C09J133/00;C09J161/06;C09J163/00 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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