| 摘要 |
A semiconductor system ( 200 ) of one or more semiconductor interposers ( 201 ) with a certain dimension ( 210 ), conductive vias ( 212 ) extending from the first to the second surface, with terminals and attached non-reflow metal studs ( 215 ) at the ends of the vias. A semiconducting interposer surface may include discrete electronic components or an integrated circuit. One or more semiconductor chips ( 202, 203 ) have a dimension ( 220, 230 ) narrower than the interposer dimension, and an active surface with terminals and non-reflow metal studs ( 224, 234 ). One chip is flip-attached to the first interposer surface, and another chip to the second interposer surface, so that the interposer dimension projects over the chip dimension. An insulating substrate ( 204 ) has terminals and reflow bodies ( 242 ) to connect to the studs of the projecting interposer.
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