THERMOSETTING RESIN COMPOSITION AND PHOTOSEMICONDUCTOR ENCAPSULATION MATERIAL

摘要

A thermosetting resin composition which contains, as an essential ingredient, (A) one or more organopolysiloxanes comprising a compound represented by the following general formula (1) or (2); and a peripheral material for photosemiconductors which employs this composition. [In the formulae, R1's each independently represents an (un)substituted C1-10 monovalent hydrocarbon group; R2 represents an epoxidized organic group; R3 represents R1 or R2; a's each independently is an integer of 1 or larger; b's each independently is an integer of 0 or larger; X represents the general formula (3); Y represents-O-or a C1-6 divalent hydrocarbon group; and Z represents the formula (4) (wherein R1's each independently represents an (un)substituted C1-10 monovalent hydrocarbon group and c is an integer of 0 or larger).]