发明名称 |
Semiconductor apparatus and manufacturing method of semiconductor apparatus |
摘要 |
A technique capable of improving reliability of a semiconductor apparatus is provided. A semiconductor device having a metal electrode on at least one principal surface and a die pad (a metal member) electrically connected to the metal electrode via conductive resin composed of base resin (an organic binder) mixed with a Ag particle (metal powder) including precious metal are provided, and a configuration is made so that a porous nano-particle coat film (a precious metal layer) having an Ag (precious metal) nano particle fired on a metal surface is formed on at least one of mutually opposed surfaces of the metal electrode and the die pad.
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申请公布号 |
US2008145607(A1) |
申请公布日期 |
2008.06.19 |
申请号 |
US20070002677 |
申请日期 |
2007.12.17 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
KAJIWARA RYOICHI;ITO KAZUTOSHI |
分类号 |
B32B3/10;B32B5/16;H01L21/44 |
主分类号 |
B32B3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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