| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide benzoxazole film that is suitable for a base material of an electronic component capable of enduring extremely high temperatures, and has high rigidity and extremely high heat resistance. SOLUTION: A polyimide benzoxazole film is formed through polycondensation of aromatic diamines having a benzoxazole structure and aromatic tetracarboxylic anhydrides. When the polyimide benzoxazole film is heated at 500°C for 10 seconds after being preliminarily dried at 170°C for 7 minutes under an inert gas atmosphere, the amount of water vaporized during the heating process is not more than 10,000 ppm relative to the same polyimide benzoxazole film before being subjected to the preliminary drying process. COPYRIGHT: (C)2008,JPO&INPIT |
