ADHEISIVE COMPOSITION AND DICING DIE BONDING FILM USING THE SAME

摘要

An adhesive resin composition is provided to minimize voids generated during bonding to a semiconductor wafer at low temperature, and to prevent chips from flying away during a dicing process by maintaining high adhesiveness with the wafer. An adhesive resin composition includes (a) a thermoplastic resin having a molecular weight of 10,000 or greater, (b) an epoxy resin having a softening point of 85 °C or below, and (c) a coupling agent. The adhesive resin composition has a tack energy of the surface attached to a wafer of 1 g.mm or more at ambient temperature and 3 g.mm at 80 °C. A dicing die bonding film includes a dicing tape, and an adhesive film stacked on the dicing film, wherein the adhesive film comprises the adhesive resin composition.