| 摘要 |
PROBLEM TO BE SOLVED: To provide a solution composition which can form a cured insulation film by heat treatment at about 120°C or lower after applied to a base material, the cured insulation film being excellent in un-curling property, heat resistance, solvent resistance, electric characteristics, etc., and which enables screen printing and is suitable as a printing ink for forming an insulation film for electric electronic parts. SOLUTION: The solution composition for a cured insulation film comprises 100 pts.wt. organic solvent-soluble resin having isocyanate groups and groups reactive with epoxy groups and containing a polysiloxane skeleton, 2-40 pts.wt. polyisocyanate compound, 1-20 pts.wt. epoxy compound, and an organic solvent. When the solution composition is formed into the cured insulation film, all of the glass transition temperatures derived from the organic solvent-soluble resin, the polyisocyanate compound, and the epoxy compound become to be 160°C or lower. COPYRIGHT: (C)2008,JPO&INPIT |
