REDUCING FORMATION OF TIN WHISKERS ON A TIN PLATING LAYER

摘要

A plated substrate comprises a plating layer disposed outwardly from a substrate. The substrate comprises a substrate material, where the substrate material comprises a metal. The plating layer comprises a plating material and blocking particles. The plating material comprises grains, and the blocking particles are disposed within interstices between the grains. The blocking particles are scattered substantially uniformly throughout at least a portion of the plating layer, and contribute to formation of boundaries.