| 摘要 |
It is a semiconductor device that has a semiconductor chip on which an electrode pad is formed, an electric connection member formed on the electrode pad, an insulating layer formed on the semiconductor chip, and an electrically conductive pattern connected to the electric connection member. An opening portion corresponding to the electric connection member is formed in the conductive pattern. The conductive pattern is electrically connected to the electric connection member by an electrically conducting paste embedded in the opening portion.
|
