发明名称 METHOD OF FORMING A COBALT SILICIDE LAYER STRUCTURE AND METHOD OF FORMING A GATE STRUCTURE USING THE SAME
摘要 A method for forming a cobalt silicide layer structure and a method for forming a gate structure using the same are provided to obtain high uniformity by controlling reaction between cobalt and silicon. A thin film forming process is performed to form a thin film including a silicon nitride on a surface of a silicon substrate by performing a nitration process for a silicon substrate(10). A cobalt thin film is formed on a thin film(12) including the silicon nitride. A cobalt silicide layer is obtained from the cobalt layer by causing reaction between cobalt of the cobalt thin film and silicon of the silicon substrate. A process for forming the thin film including the silicon nitride is performed by a rapid thermal nitration process.
申请公布号 KR20080048599(A) 申请公布日期 2008.06.03
申请号 KR20060118758 申请日期 2006.11.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, YOUNG CHEON
分类号 H01L21/24;H01L21/336 主分类号 H01L21/24
代理机构 代理人
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