发明名称 |
METHOD OF FORMING A COBALT SILICIDE LAYER STRUCTURE AND METHOD OF FORMING A GATE STRUCTURE USING THE SAME |
摘要 |
A method for forming a cobalt silicide layer structure and a method for forming a gate structure using the same are provided to obtain high uniformity by controlling reaction between cobalt and silicon. A thin film forming process is performed to form a thin film including a silicon nitride on a surface of a silicon substrate by performing a nitration process for a silicon substrate(10). A cobalt thin film is formed on a thin film(12) including the silicon nitride. A cobalt silicide layer is obtained from the cobalt layer by causing reaction between cobalt of the cobalt thin film and silicon of the silicon substrate. A process for forming the thin film including the silicon nitride is performed by a rapid thermal nitration process.
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申请公布号 |
KR20080048599(A) |
申请公布日期 |
2008.06.03 |
申请号 |
KR20060118758 |
申请日期 |
2006.11.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, YOUNG CHEON |
分类号 |
H01L21/24;H01L21/336 |
主分类号 |
H01L21/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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