发明名称 Semiconductor device having oxidized metal film and manufacture method of the same
摘要 A method for manufacturing a semiconductor device includes heating a substrate having an insulation film thereon to a first substrate temperature so that oxidizing species are emitted from the insulating film, the insulating film having a recessed portion formed in a surface thereof, forming a metal film on the insulating film at a second substrate temperature lower than the first substrate temperature, and oxidizing at least part of the metal film with oxidizing species remaining in the insulating film.
申请公布号 US2008122102(A1) 申请公布日期 2008.05.29
申请号 US20080010371 申请日期 2008.01.24
申请人 发明人 SAKATA ATSUKO;WADA JUNICHI;OMOTO SEIICHI;HATANO MASAAKI;YAMASHITA SOICHI;HIGASHI KAZUYUKI;NAKAMURA NAOFUMI;YAMADA MASAKI;KINOSHITA KAZUYA;KATATA TOMIO;HASUNUMA MASAHIKO
分类号 H01L23/48 主分类号 H01L23/48
代理机构 代理人
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