| 摘要 |
PROBLEM TO BE SOLVED: To provide a base for power module, which is capable of suppressing the generation of warp of a heat dissipating substrate and an insulating substrate during manufacturing and, further, which is provided with excellent heat dissipating performance. SOLUTION: The base 1 for power module is provided with the heat dissipating substrate 2, the insulating substrate 3 with a wiring layer 7 formed on the upper surface thereof and a heat transfer layer 8 formed on the lower surface thereof while the heat transfer layer 8 is brazed on the upper surface of the heat dissipating substrate 2, heat dissipating fins 4 brazed to the lower surface of the heat dissipating substrate 2 and a cooling jacket 5 fixed to the lower surface of the heat dissipating substrate 2 so as to cover the heat dissipating fins 4 while being formed so as to make cooling liquid flow through the inside thereof. A through hole 6 is formed on the heat dissipating substrate 2. A power device P is connected to the wiring layer 7 of the insulating substrate 3 through soldering while at least a part of the power device is superposed on the through hole 6 in the plan view thereof. COPYRIGHT: (C)2008,JPO&INPIT |
