发明名称 ANISOTROPICALLY ELECTROCONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPICALLY ELECTROCONDUCTIVE FILM, CONNECTION STRUCTURE OF CIRCUIT MEMBER AND PROCESS FOR PRODUCING COATED PARTICLE
摘要 PROBLEM TO BE SOLVED: To provide an anisotropically electroconductive adhesive composition that can sufficiently prevent the occurrence of short circuit between adjacent circuit electrodes due to the aggregation of dispersed electroconductive particles even in the case when a connection pitch is narrow and can achieve excellent long-term connection reliability. SOLUTION: The anisotropically electroconductive adhesive composition is used for connecting a first circuit member having a first circuit electrode formed on the main surface of a first substrate to a second circuit member having a second circuit electrode formed on the main surface of a second substrate in such a manner that the first circuit electrode and the second circuit electrode are oppositely disposed and comprises (A) an adhesive and (B) a coated particle formed by coating a polar group-containing electroconductive particle having a polar group on at least part of the surface thereof with an insulating material comprising a polymer electrolyte capable of adsorbing the polar group and a fine inorganic oxide particle capable of adsorbing the polymer electrolyte. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008120990(A) 申请公布日期 2008.05.29
申请号 JP20070160585 申请日期 2007.06.18
申请人 HITACHI CHEM CO LTD 发明人 TAKANE NOBUAKI;TAKAI KENJI
分类号 C09J201/00;C09J7/00;C09J9/02;C09J11/00;H01B1/20;H01B13/00;H01L21/60;H01R11/01 主分类号 C09J201/00
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