| 摘要 |
PROBLEM TO BE SOLVED: To provide a material which is excellent in electrical insulation property, solder resistance and the resistance to repeated bending and can be subjected to screen printing or spin coating. SOLUTION: The active radiation-curing resin composition contains at least a polyamide-imide resin having an unsaturated group and an unsaturated compound containing a hydroxyl group within the molecule. The composition is obtained by compounding the unsaturated compound containing a hydroxyl group and a compound preferably containing two or more unsaturated groups with the polyamide-imide resin containing the unsaturated group. The polyamide-imide resin is preferably obtained by copolymerizing an isophorone ring and a flexible component chosen from an acrylonitrile-butadiene, a polyester, a polyalkylene glycol and a dimer acid. An active radiation-curing resin ink, a printed circuit board and a semiconductor device using the same are also provided. COPYRIGHT: (C)2008,JPO&INPIT
|
