Memory module i.e. very low profile memory module, for use in motherboard, has sets of passive components arranged between memory device and connecting surfaces, where device is arranged on main surface of printed circuit board

摘要

The module has a printed circuit board including a main surface (10) including two sides (101, 102). A set (13) of passive components (31) is connected with a memory device (11). Another set (14) of passive components (41) is connected with another memory device (12). The sets of passive components are arranged between the memory device (11) and connecting surfaces (25). The memory devices are arranged on the main surface, to make a longer side of the memory device (11) parallel to the side (101). An independent claim is also included for a motherboard for an electronic device.