发明名称 LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, MANUFACTURING METHOD OF WIRING SUBSTRATE, MANUFACTURING METHOD OF DISPLAY APPARATUS AND WIRING SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a simplified and reliable laser processing method in which both improvement of a manufacture yield and reduction of manufacture throughput are obtained. <P>SOLUTION: The laser processing method includes: the steps of selecting a wavelength of laser light based on a reflectance of a multilayer film formed of two or more layers with different materials of a processing object 3; and irradiating the processing object 3 with the laser light to perform laser processing. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008112954(A) 申请公布日期 2008.05.15
申请号 JP20070002585 申请日期 2007.01.10
申请人 SONY CORP 发明人 SHIMODA KAZUTO;KOSHIISHI AKIRA;TOMIOKA SATOSHI;KAWABE HIDEO
分类号 H01L21/3205;H01L23/52 主分类号 H01L21/3205
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