发明名称 |
LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, MANUFACTURING METHOD OF WIRING SUBSTRATE, MANUFACTURING METHOD OF DISPLAY APPARATUS AND WIRING SUBSTRATE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a simplified and reliable laser processing method in which both improvement of a manufacture yield and reduction of manufacture throughput are obtained. <P>SOLUTION: The laser processing method includes: the steps of selecting a wavelength of laser light based on a reflectance of a multilayer film formed of two or more layers with different materials of a processing object 3; and irradiating the processing object 3 with the laser light to perform laser processing. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
申请公布号 |
JP2008112954(A) |
申请公布日期 |
2008.05.15 |
申请号 |
JP20070002585 |
申请日期 |
2007.01.10 |
申请人 |
SONY CORP |
发明人 |
SHIMODA KAZUTO;KOSHIISHI AKIRA;TOMIOKA SATOSHI;KAWABE HIDEO |
分类号 |
H01L21/3205;H01L23/52 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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