| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of preventing boron contamination of wafers, which is capable of protecting the wafers subjected to a cleaning treatment against boron contamination while they are kept on standby or in storage. SOLUTION: The method of preventing the boron contamination of wafers comprises a process of carrying out a cleaning treatment, where an HF treatment with HF or HF containing a surface-active agent is carried out as a final process, in a cleaning process in which the wafer, whose semiconductor surface is partially exposed because an oxide film is removed from the surface, is cleaned so as to terminate its exposed semiconductor surface with hydrogen before the wafers are kept on standby or in storage in a clean room. COPYRIGHT: (C)2008,JPO&INPIT
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