| 摘要 |
A method for manufacturing an electronic component includes preparing an element substrate having a function section for providing a function of an electronic component, and an external-connection electrode; bonding a low-sandblast-resistant case plate to the element substrate through a high-sandblast-resistant adhesive layer; forming, by sandblast processing, a hole in the case plate above the external-connection electrode so that the adhesive layer is exposed to the outside; removing, by etching, an adhesive layer portion that is exposed in the hole; forming an electrode film so as to be electrically connected to the exposed external-connection electrode; and forming, by mechanical machining, a projection having a leading end surface on which a terminal electrode resulting from the electrode film is defined.
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