发明名称 |
Compositions and methods for CMP of low-k-dielectric materials |
摘要 |
The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing low-k dielectric materials. The composition comprises a particulate abrasive material, at least one silicone-free nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, at least one silicone-containing nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, and an aqueous carrier therefor. A CMP method for polishing a low-k dielectric surface utilizing the composition is also disclosed.
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申请公布号 |
US2008111101(A1) |
申请公布日期 |
2008.05.15 |
申请号 |
US20060595536 |
申请日期 |
2006.11.09 |
申请人 |
KELEHER JASON;WOODLAND DANIEL;DE REGE THESAURO FRANCESCO;MEDSKER ROBERT;AGGIO JASON |
发明人 |
KELEHER JASON;WOODLAND DANIEL;DE REGE THESAURO FRANCESCO;MEDSKER ROBERT;AGGIO JASON |
分类号 |
C09K13/00 |
主分类号 |
C09K13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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