| 摘要 |
PROBLEM TO BE SOLVED: To provide a phase-changing heat dissipating member which has low thermal resistance, is excellent in workability and is suitable as a heat dissipating material of an electronic component. SOLUTION: The phase-changing heat dissipating member comprises a metal layer with Vickers hardness of 24 Hv or less laminated on at least one of surfaces of a layer made of a thermo-conductive resin composition containing an organic ingredient of 15-35 mass% including a resin softening at 30-120°C and an inorganic filler of 65-90 mass% including a powder (a) with an average particle diameter of 0.3-1.9μm and a powder b with an average particle diameter of 2-20μm with a volume ratio of a/b=7/3 to 3/7. COPYRIGHT: (C)2008,JPO&INPIT
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