发明名称 |
Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof |
摘要 |
A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.
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申请公布号 |
US2008105457(A1) |
申请公布日期 |
2008.05.08 |
申请号 |
US20080007178 |
申请日期 |
2008.01.08 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
EGITTO FRANK D.;MARKOVICH VOYA R.;MATIENZO LUIS J. |
分类号 |
H05K1/03 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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