COMPONENT FOR SUBSTRATE PROCESSING APPARATUS AND METHOD OF FORMING FILM ON THE COMPONENT

摘要

A substrate processing apparatus that can prevent particles from being produced through chipping of a film. The film is formed on a surface of a component for the substrate processing apparatus by an anodic oxidization process in which the component is connected to the anode of a direct-current power source and immersed in a solution consisting mainly of an organic acid. The film is subjected to a semi-sealing process using boiling water.